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Modeling and Analysis of Loading Effect in Leakage of Nano-Scaled Bulk-CMOS Logic Circuits

机译:纳米鳞片泄漏负荷效应的建模与分析   批量CmOs逻辑电路

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摘要

In nanometer scaled CMOS devices significant increase in the subthreshold,the gate and the reverse biased junction band-to-band-tunneling (BTBT) leakage,results in the large increase of total leakage power in a logic circuit.Leakage components interact with each other in device level (through devicegeometry, doping profile) and also in the circuit level (through nodevoltages). Due to the circuit level interaction of the different leakagecomponents, the leakage of a logic gate strongly depends on the circuittopology i.e. number and nature of the other logic gates connected to its inputand output. In this paper, for the first time, we have analyzed loading effecton leakage and proposed a method to accurately estimate the total leakage in alogic circuit, from its logic level description considering the impact ofloading and transistor stacking.
机译:在纳米级CMOS器件中,亚阈值显着增加,栅极和反向偏置结带对带隧道泄漏(BTBT)泄漏导致逻辑电路中的总泄漏功率大大增加。泄漏元件彼此相互作用在器件级(通过器件的几何形状,掺杂分布)以及电路级(通过节点电压)。由于不同泄漏组件的电路级交互作用,逻辑门的泄漏在很大程度上取决于电路拓扑,即连接到其输入和输出的其他逻辑门的数量和性质。在本文中,我们首次分析了负载对泄漏的影响,并提出了一种方法,该方法从逻辑电路的逻辑电平描述中考虑了负载和晶体管堆叠的影响,可以准确地估算逻辑电路中的总泄漏。

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